Technical information

Precautions for handling crystal products

Soldering
Please use our recommended reflow temperature profile for reflow soldering. Further please avoid temperature higher than recommended conditions as our product may deteriorate.
Cleaning
Please avoid ultrasonic cleaning with the unit and unit mounted on the printed circuit board, as the tuning fork crystal may deteriorate because of resonant frequency nearby general ultrasonic
Product Storage
Please store the product in an environment where the temperature is 5 to 35℃, humidity is 45 to 85%, and atmospheric pressure is 86 to 106 kPa, avoiding direct sunlight. Solderability may deteriorate if the product is stored under high temperature and high humidity.
Other Notes
Please note that excessive impact may be applied to the product when the board is broken after mounting, and the product may deteriorate. Please avoid processing such as ultrasonic welding to the mounting board, as it may cause product deterioration or failure because excessive force is applied to the inside of the crystal product.

Handling Notes for Crystal oscillator

Soldering
Please use our recommended reflow temperature profile for reflow soldering. Further please avoid temperature higher than recommended conditions as our product may deteriorate.
Cleaning
Please avoid ultrasonic cleaning with the unit and unit mounted on the printed circuit board, as the tuning fork crystal may deteriorate because of resonant frequency nearby general ultrasonic.
Product Storage
Please store the product in an environment where the temperature is 5 to 35℃, humidity is 45 to 85%, and atmospheric pressure is 86 to 106 kPa, avoiding direct sunlight. Solderability may deteriorate if the product is stored under high temperature and high humidity.
Electrostatic
Please take countermeasure for electrostatics as it may cause product deterioration or failure if excessive electrostatics apply to crystal product.
Other Notes
Please note that excessive impact may be applied to the product when the board is broken after mounting, and the product may deteriorate. Please avoid processing such as ultrasonic welding to the mounting board, as it may cause product deterioration or failure because excessive force is applied to the inside of the crystal product.

Recommended Reflow profile for Lead free soldering

FCXO-07,-06,-05
Profile feature Condition
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from Tsmin to Tsmax

150 ℃
200 ℃
60 to 120 seconds
Main heat
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above

3 ℃/second max. 217 ℃
60 to 150 seconds
Peak
Peak temperature (Tp)
Time within 5 ℃ of actual Tp (tp)
Ramp-down rate

260 ℃ max.
30 seconds max.
6 ℃/second max.
Time 25℃ to Peak temperature 8 minutes max.
swipe

* Maximum Reflow Conditions in accordance with IPC/JEDEC J-STD-020

Questions, business meetings, etc.
Please contact us with any queries.